Characteristics
◆ High-performance UV Laser Source: Use diode-pumped UV Laser source with high beam quality, high peak power and short pulse width, which can achieve “cold “processing that ensures the stability and quality.
◆ Optimized Optical System: Optimized optical transmission system with low power consumption, small focused spot size, high beam quality to ensure the reliability and consistency of the quality.
◆ High-precision Motion System: Imported high precision linear motion module and control module, ensure the device has high position accuracy and repeatability.
◆ Machine vision system: With two high resolution CCD cameras, combing self-developed image processing algorithm to ensure accuracy and efficiency of the processing.
◆ Natural Granite Platform: Natural and massive granite base reduces the inertia vibration of the table during start-up, shut-down and acceleration. At the same time, it maintains structure size long-term stability.
◆ Software: With intelligent processing platform software-Thetalaser, which is a smart laser micromachining application platform, user-friendly easy to operate and enabling customized software modules.
Application Range
◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package.
◆ De-panelizing assembled flexible or rigid circuits.
◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm.
◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc.
◆ Precisely cutting ITO thin film, glass, organic thin film, special metal sheet, wafer and sapphire, etc.
◆ Support Roll to Roll Cutting way.(option)
Technical Specifications: (3 Sigma)
Model |
TLS-G8200 |
Cutting Area |
500mm×500mm×50mm(Customizable) |
Accuracy of X/Y |
<±3µm |
Repeatability of X/Y Axis |
±1µm |
X/Y moving speed |
800mm/s max |
Laser Wavelength |
355nm |
Laser Repetition Rate |
30-130KHz |
Operating Temperature |
23±3℃ |
Operation Humidity |
20%~70%RH(no dew) |
Input Data Format |
Gerber, DXF, HPGL, Sieb&Meyer, Excellon, PCB |
Input Voltage |
3Φ,380VAC±10%, 50/60Hz, 15A |
Power Consumption |
3.0KW |
Compressed Air Pressure |
0.7~0.8MPa |
Machine Size(LxWxH) |
2125mm×1840mm×1800mm |
Weight |
3500Kg |
Origin |
China |
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